XO 4 Parts

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In the pre-production SKUs, vendors are explicitly specified, allowing us to more easily identify problems specific to a particular component. In production, a particular SKU may contain various qualified parts for a specific component. This chart details the components used in XO-4 preproduction laptops:

XO-4 Qualification SKUs
Build SKU CPU DDR3 DRAM eMMC Flash ROM Cam TP Keyboard
A2 none 1 GHz Hynix 256Mx16, H5TC4G63MFR-PBA Sandisk 4GB 24nm, SDIN5D2-4G-L OV var various
B1 291 1 GHz Hynix 128Mx16, H5TC2G63DFR-PBA SanDisk 4GB 24nm, SDIN5D2-4G-L OV Synaptics grid English
292 1 GHz Nanya 128Mx16, NT5CC128M16HP-DI SanDisk 8GB 24nm, SDIN5C2-8G-L OV AVC crunchy US/Intl
293 1 GHz Hynix 256Mx16, H5TC4G63MFR-PBA Toshiba 8GB 24nm, THGBM4G6D2HBAIR OV AVC crunchy US/Intl
294 1 GHz Hynix 128Mx16, H5TC2G63DFR-PBA SanDisk 4GB 24nm, SDIN5D2-4G-L OV Synaptics grid Spanish
C1 295 1 GHz Micron 256Mx16, MT41K256M16HA-125:E Toshiba 8GB 19nm, THGBM5G6A1JBAI OV AVC grid US/Intl
296 1.2 GHz Nanya 256Mx16, NT5CC256M16BP-D Toshiba 8GB 24nm, THGBM4G6D2HBAIR SETi Synaptic crunchy US/Intl
297 1.2 GHz Hynix 128Mx16, H5TC2G63DFR-PBA Toshiba 4GB 19nm, THGBM5G5A1JBAIR OV AVC grid US/Intl
298 1 GHz Micron 128Mx16, MT41K128M16JT-125:K Micron 4GB 24nm, MTFC4GMXEA-WT SETi Synaptic crunchy US/Intl

Testing builds are small runs made during production to test new components.

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