Talk:Notes on using the OLPC developer boards: Difference between revisions
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(Canning is encapsulation at RF level) |
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Excuse my ignorance, but what exactly <em>is</em> "canning" in the context of wireless hardware? I'm not completely foreign to electronics and associated jargons, but being involved with OLCP is the first time I've heard the term used in such a context. |
Excuse my ignorance, but what exactly <em>is</em> "canning" in the context of wireless hardware? I'm not completely foreign to electronics and associated jargons, but being involved with OLCP is the first time I've heard the term used in such a context. |
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--[[User:Yangman|Yangman]] 14:56, 5 July 2006 (EDT) |
--[[User:Yangman|Yangman]] 14:56, 5 July 2006 (EDT) |
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== Canning is encapsulation at RF level == |
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Canning is putting a shield around the RF (radio frequency) components. You'll see on the board a copper border around the wireless space. A metal shield, in the form of a box with one side missing, is placed over this area, and soldered down. |
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An RF shield decreases noise received, decreases noise emitted, and therefore increases range of the wireless circuit and antenna. |
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Revision as of 23:28, 5 July 2006
Connector/LED documentation moved to main article.
Excuse my ignorance, but what exactly is "canning" in the context of wireless hardware? I'm not completely foreign to electronics and associated jargons, but being involved with OLCP is the first time I've heard the term used in such a context. --Yangman 14:56, 5 July 2006 (EDT)
Canning is encapsulation at RF level
Canning is putting a shield around the RF (radio frequency) components. You'll see on the board a copper border around the wireless space. A metal shield, in the form of a box with one side missing, is placed over this area, and soldered down.
An RF shield decreases noise received, decreases noise emitted, and therefore increases range of the wireless circuit and antenna.