XO1.75 EC Breadboard: Difference between revisions
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This page describes an engineering prototype used briefly during the bringup of the XO-1.75 design, in order to further software development of the [[Embedded controller]] and the [[XO_1.75_HOST_to_EC_Protocol|XO-1.75 Host/EC communications protocol]]. |
This page describes an engineering prototype used briefly during the bringup of the XO-1.75 design, in order to further software development of the [[Embedded controller]] and the [[XO_1.75_HOST_to_EC_Protocol|XO-1.75 Host/EC communications protocol]]. |
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==Documentation== |
==Documentation== |
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* [[Media:XO1.75_EC_Breadboard_Block.pdf|Block Diagram (PDF)]] |
* [[Media:XO1.75_EC_Breadboard_Block.pdf|Block Diagram (PDF)]] |
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The heart of the breadboard is a ZIF socket for the 0.4 mm pin pitch 128 pin QFP package used by the KB3930. This is part number PA-QFE128SD-C-Z-02W, purchased from [http://www.ironwoodelectronics.com/ Ironwood Electronics]. It includes an adapter PCB, and a wire-wrap adapter attached to that. This was mounted on a piece of 0.1" perfboard, onto which the required connectors and switches were epoxied. |
The heart of the breadboard is a ZIF socket for the 0.4 mm pin pitch 128 pin QFP package used by the KB3930. This is part number PA-QFE128SD-C-Z-02W, purchased from [http://www.ironwoodelectronics.com/ Ironwood Electronics]. It includes an adapter PCB, and a wire-wrap adapter attached to that. This was mounted on a piece of 0.1" perfboard, onto which the required connectors and switches were epoxied. |
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[[Image:XO1.75_EC_Breadboard_Top.jpg|thumb|200px|right]] |
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Copper tape was used to supply +3.3V and ground. A sprinkling of 0.1 uF SMD-1206 caps provides decoupling between these. |
Copper tape was used to supply +3.3V and ground. A sprinkling of 0.1 uF SMD-1206 caps provides decoupling between these. |
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[[Image:XO1.75_EC_Breadboard_Bottom.jpg|thumb|200px|center]] |
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Attaching to the Bonnell development board proved very difficult. I ended up tying to resistor and transistor pads, and a couple of test points, but had to epoxy over the wiring as the pads lifted off the PCB with the slightest force. |
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[[Image:XO1.75_EC_Breadboard_System.jpg|thumb|200px|left]] |
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Revision as of 04:26, 13 October 2010
This page describes an engineering prototype used briefly during the bringup of the XO-1.75 design, in order to further software development of the Embedded controller and the XO-1.75 Host/EC communications protocol.
Documentation
The breadboard is powered by any XO power supply.
Construction
The heart of the breadboard is a ZIF socket for the 0.4 mm pin pitch 128 pin QFP package used by the KB3930. This is part number PA-QFE128SD-C-Z-02W, purchased from Ironwood Electronics. It includes an adapter PCB, and a wire-wrap adapter attached to that. This was mounted on a piece of 0.1" perfboard, onto which the required connectors and switches were epoxied.
Copper tape was used to supply +3.3V and ground. A sprinkling of 0.1 uF SMD-1206 caps provides decoupling between these.
Attaching to the Bonnell development board proved very difficult. I ended up tying to resistor and transistor pads, and a couple of test points, but had to epoxy over the wiring as the pads lifted off the PCB with the slightest force.
