XO 1.75 Parts

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In the pre-production SKUs, vendors are explicitly specified, allowing us to more easily identify problems specific to a particular component. In production, a particular SKU may contain various qualified parts for a specific component. This chart details the components used in XO-1.75 preproduction laptops:

XO-1.75 Qualification SKUs

Build	SKU	DDR3 DRAM	eMMC Flash ROM	LP Sus	Keyboard
B1	198	Hynix 128Mx8, H5TQ1G83TFR-H9C	Toshiba 4GB 32nm, THGBM3G5D1FBAIE		chewy
	199	Samsung 128Mx8, K4B1G0846G-BCH9	Sandisk 4GB 32nm, SDIN5C2-4G		crunchy
C1	200	Nanya 128Mx8, NT5CB128M8DN-CF	Toshiba 8GB 24nm, THGBM4G6D2HBAIR		grid T5
	201	Hynix 256Mx8, H5TQ2G83BFR-H9C	Toshiba 8GB 24nm, THGBM4G6D2HBAIR		crunchy
	202	Nanya 256Mx8, NT5CB256M8BN-CG	Sandisk 8GB 32nm, SDIN5C2-8G		grid T4 portuguese
Ramp	203	Hynix, 128Mx8, H5TQ1G83TFR-H9C	SanDisk 4GB 32nm, SDIN5C2-4G		grid T6
	204	Hynix, 256Mx8, H5TQ2G83BFR-H9C	Toshiba 8GB 24nm, THGBM4G6D2HBAIR	Y	crunchy
Testing	200X1	Nanya, 256Mx8, NT5CB256M8BN-CG	Toshiba 4GB 24nm, THGBM4G5D1HBAIR	Y	various
	200X2	Hynix, 128Mx8, H5TQ2G83TFR-H9C	Toshiba 4GB 24 nm, THGBM4G6D2HBAIR	Y	various
	200X3	Nanya, 256Mx8, NT5CB256M8BN-CG	Sandisk 8GB 24 nm, SDIN5C2-8G-L	Y	various
	200X4	Nanya, 256Mx8, NT5CB256M8BN-CG	Sandisk 4GB 24 nm, SDIN5D2-4G	Y	various
	200X5	Hynix, 256Mx8, H5TQ2G83CFR-H9C	Toshiba 4GB 24 nm, THGBM5G5A1JBAIR	Y	various
	200X6	Nanya, 256Mx8, NT5CB256M8GN-CG	Toshiba 8GB 24nm, THGBM4G6D2HBAIR	Y	various
	200X7	Hynix, 256Mx8, H5TQ2G83CFR-H9C	Sandisk 4GB 24 nm, SDIN5D2-4G	Y	various
	200X8	Hynix, 256Mx8, H5TQ2G83CFR-H9C	Sandisk 4GB 24 nm, SDIN7DP2-8G	Y	various
	200X9	Hynix, 256Mx8, H5TQ2G83CFR-H9C	Micron 21A18 JW866	Y	various
	200XA	Hynix, 256Mx8, H5TQ2G83CFR-H9C	Micron 2LA18 JW866	Y	various

LP Sus -- indicates that a SKU is capable of reaching the expected power levels in suspend, using the "hardware" suspend method.

Testing builds are small runs made during production to test new components.