XO 4 Parts

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In the pre-production SKUs, vendors are explicitly specified, allowing us to more easily identify problems specific to a particular component. In production, a particular SKU may contain various qualified parts for a specific component. This chart details the components used in XO-4 preproduction laptops:

XO-4 Qualification SKUs

Build	SKU	CPU	DDR3 DRAM	eMMC Flash ROM	Cam	TP	Keyboard
A2	none	1 GHz	Hynix 256Mx16, H5TC4G63MFR-PBA	Sandisk 4GB 24nm, SDIN5D2-4G-L	OV	various	various
B1	291	1 GHz	Hynix 128Mx16, H5TC2G63DFR-PBA	SanDisk 4GB 24nm, SDIN5D2-4G-L	OV	Synaptics	grid English
	292	1 GHz	Nanya 128Mx16, NT5CC128M16HP-DI	SanDisk 8GB 24nm, SDIN5C2-8G-L	OV	AVC	crunchy US/Intl
	293	1 GHz	Hynix 256Mx16, H5TC4G63MFR-PBA	Toshiba 8GB 24nm, THGBM4G6D2HBAIR	OV	AVC	crunchy US/Intl
	294	1 GHz	Hynix 128Mx16, H5TC2G63DFR-PBA	SanDisk 4GB 24nm, SDIN5D2-4G-L	OV	Synaptics	grid Spanish
C1	295	1 GHz	Micron 256Mx16, MT41K256M16HA-125:E	Toshiba 8GB 19nm, THGBM5G6A1JBAI	OV	AVC	grid US/Intl
	296	1.2 GHz	Nanya 256Mx16, NT5CC256M16BP-D	Toshiba 8GB 24nm, THGBM4G6D2HBAIR	SETi	Synaptic	crunchy US/Intl
	297	1.2 GHz	Hynix 128Mx16, H5TC2G63DFR-PBA	Toshiba 4GB 19nm, THGBM5G5A1JBAIR	OV	AVC	grid US/Intl
	298	1 GHz	Micron 128Mx16, MT41K128M16JT-125:K	Micron 4GB 24nm, MTFC4GMXEA-WT	SETi	Synaptic	crunchy US/Intl

A2 and B1 builds came with the 802.11bg WLAN module (88W8686). C1 builds all have 802.11abgn WLAN modules (88W8787).

Testing builds are small runs made during production to test new components.