Talk:Notes on using the OLPC developer boards: Difference between revisions

From OLPC
Jump to navigation Jump to search
No edit summary
(Fixed)
 
(25 intermediate revisions by 6 users not shown)
Line 1: Line 1:
Connector/LED documentation moved to main article.
Where are the specifications for the rest of the connectors on the board?
The only two I've discerned from the Wiki so far are the obvious ones:
* IO for serial breakout (U20? numbering unclear)
* CON_ANT1
* CON_ANT2
* USB: CN4, CN6, CN7


----
Could somebody also identify the connector type for the antenna?


Excuse my ignorance, but what exactly <em>is</em> "canning" in the context of wireless hardware? I'm not completely foreign to electronics and associated jargons, but being involved with OLCP is the first time I've heard the term used in such a context.
Unknown connectors/LEDs
--[[User:Yangman|Yangman]] 14:56, 5 July 2006 (EDT)
* CN20 5-pin

* CN15 2-pin
Canning is RF encapsulation. It means putting a shield around the RF (radio frequency) components. You'll see on the board a copper border around the wireless space. A metal shield, in the form of a box with one side missing, is placed over this area, and soldered down. An RF shield decreases noise received, decreases noise emitted, and therefore increases range of the wireless circuit and antenna. It also helps the device to meet electromagnetic compatibility regulations, or other regulations concerning radios.
* CN18 4-pin with jumper @ 1-3
--[[User:Quozl|Quozl]] 19:33, 5 July 2006 (EDT)
* CN19 (solder pads only in A-test)

* CN23 6-pin
Ah, so it literally is canning, like I suspected, and not some jargon. Thanks.
* CN22 2-pin
--[[User:Yangman|Yangman]] 01:58, 6 July 2006 (EDT)
* CN21 2-pin, large pitch (power?)

* CN16 2x8=16 pins
== Please fix the LinuxBIOS discussion in this page ==
* CN14 (solder pads only in A-test)

* CN17 (solder pads only in A-test)
Please fix the LinuxBIOS discussion which is out of date.
* CN1 ribbon connector
: Done - thanks. - [[User:JordanCrouse|JordanCrouse]] ([[User talk:JordanCrouse|Talk to me!]]) 12:32, 14 September 2006 (EDT)
* CN2 (solder pads only in A-test)
* CN9 4-pin
* CN8 2-pin? (solder pads only in A-test)
* D2
* D3
* D4
* D21
* D22
* D23

Latest revision as of 16:32, 14 September 2006

Connector/LED documentation moved to main article.


Excuse my ignorance, but what exactly is "canning" in the context of wireless hardware? I'm not completely foreign to electronics and associated jargons, but being involved with OLCP is the first time I've heard the term used in such a context. --Yangman 14:56, 5 July 2006 (EDT)

Canning is RF encapsulation. It means putting a shield around the RF (radio frequency) components. You'll see on the board a copper border around the wireless space. A metal shield, in the form of a box with one side missing, is placed over this area, and soldered down. An RF shield decreases noise received, decreases noise emitted, and therefore increases range of the wireless circuit and antenna. It also helps the device to meet electromagnetic compatibility regulations, or other regulations concerning radios. --Quozl 19:33, 5 July 2006 (EDT)

Ah, so it literally is canning, like I suspected, and not some jargon. Thanks. --Yangman 01:58, 6 July 2006 (EDT)

Please fix the LinuxBIOS discussion in this page

Please fix the LinuxBIOS discussion which is out of date.

Done - thanks. - JordanCrouse (Talk to me!) 12:32, 14 September 2006 (EDT)