XO 4 Parts: Difference between revisions
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|rowspan="1"|[[XO_4_A2|A2]] |
|rowspan="1"|[[XO_4_A2|A2]] |
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|none |
|none |
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|Hynix 256Mx16 |
|Hynix 256Mx16, H5TC4G63MFR-PBA |
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|Sandisk |
|Sandisk 4GB 24nm, SDIN5D2-4G-L |
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|OV |
|OV |
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|var |
|var |
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Revision as of 18:28, 5 September 2012
This page is monitored by the OLPC team.
In the pre-production SKUs, vendors are explicitly specified, allowing us to more easily identify problems specific to a particular component. In production, a particular SKU may contain various qualified parts for a specific component. This chart details the components used in XO-4 preproduction laptops:
| Build | SKU | DDR3 DRAM | eMMC Flash ROM | Cam | TP | Keyboard |
| A2 | none | Hynix 256Mx16, H5TC4G63MFR-PBA | Sandisk 4GB 24nm, SDIN5D2-4G-L | OV | var | various |
| B1 | 291 | Hynix 128Mx16, H5TC2G63DFR-PBA | SanDisk 4GB 24nm, SDIN5D2-4G-L | SETi | Synaptics | grid Spanish |
| 292 | Nanya 128Mx16, NT5CC128M16HP-DI | SanDisk 8GB 24nm, SDIN5C2-8G-L | OV | AVC | crunchy US/Intl | |
| 293 | Hynix 256Mx16, H5TC4G63MFR-PBA | Toshiba 8GB 24nm, THGBM4G6D2HBAIR | OV | AVC | crunchy US/Intl |
Testing builds are small runs made during production to test new components.