XO 4 Parts: Difference between revisions
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A2 and B1 builds came with the 802.11bg WLAN module (88W8686). C1 builds all have 802.11abgn WLAN modules (88W8787). |
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Testing builds are small runs made during production to test new components. |
Testing builds are small runs made during production to test new components. |
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Latest revision as of 03:02, 16 November 2012
This page is monitored by the OLPC team.
In the pre-production SKUs, vendors are explicitly specified, allowing us to more easily identify problems specific to a particular component. In production, a particular SKU may contain various qualified parts for a specific component. This chart details the components used in XO-4 preproduction laptops:
| Build | SKU | CPU | DDR3 DRAM | eMMC Flash ROM | Cam | TP | Keyboard |
| A2 | none | 1 GHz | Hynix 256Mx16, H5TC4G63MFR-PBA | Sandisk 4GB 24nm, SDIN5D2-4G-L | OV | various | various |
| B1 | 291 | 1 GHz | Hynix 128Mx16, H5TC2G63DFR-PBA | SanDisk 4GB 24nm, SDIN5D2-4G-L | OV | Synaptics | grid English |
| 292 | 1 GHz | Nanya 128Mx16, NT5CC128M16HP-DI | SanDisk 8GB 24nm, SDIN5C2-8G-L | OV | AVC | crunchy US/Intl | |
| 293 | 1 GHz | Hynix 256Mx16, H5TC4G63MFR-PBA | Toshiba 8GB 24nm, THGBM4G6D2HBAIR | OV | AVC | crunchy US/Intl | |
| 294 | 1 GHz | Hynix 128Mx16, H5TC2G63DFR-PBA | SanDisk 4GB 24nm, SDIN5D2-4G-L | OV | Synaptics | grid Spanish | |
| C1 | 295 | 1 GHz | Micron 256Mx16, MT41K256M16HA-125:E | Toshiba 8GB 19nm, THGBM5G6A1JBAI | OV | AVC | grid US/Intl |
| 296 | 1.2 GHz | Nanya 256Mx16, NT5CC256M16BP-D | Toshiba 8GB 24nm, THGBM4G6D2HBAIR | SETi | Synaptic | crunchy US/Intl | |
| 297 | 1.2 GHz | Hynix 128Mx16, H5TC2G63DFR-PBA | Toshiba 4GB 19nm, THGBM5G5A1JBAIR | OV | AVC | grid US/Intl | |
| 298 | 1 GHz | Micron 128Mx16, MT41K128M16JT-125:K | Micron 4GB 24nm, MTFC4GMXEA-WT | SETi | Synaptic | crunchy US/Intl |
A2 and B1 builds came with the 802.11bg WLAN module (88W8686). C1 builds all have 802.11abgn WLAN modules (88W8787).
Testing builds are small runs made during production to test new components.