XO 1.75 Parts: Difference between revisions

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{{OLPC}}
{{OLPC}}

In the pre-production SKUs, vendors are explicitly specified, allowing us to more easily identify problems specific to a particular component. In production, a particular SKU may contain various qualified parts for a specific component. This chart details the components used in [[XO-1.75]] preproduction laptops:


{| border="1" align="center" cellpadding="6"
{| border="1" align="center" cellpadding="6"
Line 6: Line 8:
|'''Build'''
|'''Build'''
|'''SKU'''
|'''SKU'''
|'''DDR3'''
|'''DDR3 DRAM'''
|'''eMMC'''
|'''eMMC Flash ROM'''
|'''LP Sus'''
|'''LP<br>Sus'''
|'''Keybd'''
|'''Keyboard'''
|- align="center"
|- align="center"
|[[XO_1.75_B1|B1]]
|rowspan="2"|[[XO_1.75_B1|B1]]
|198
|198
|Hynix 128Mx8, H5TQ1G83TFR-H9C
|Hynix 128Mx8, H5TQ1G83TFR-H9C
Line 18: Line 20:
|chewy
|chewy
|- align="center"
|- align="center"
|[[XO_1.75_B1|B1]]
|199
|199
|Samsung 128Mx8, K4B1G0846G-BCH9
|Samsung 128Mx8, K4B1G0846G-BCH9
Line 25: Line 26:
|crunchy
|crunchy
|- align="center"
|- align="center"
||[[XO_1.75_C1|C1]]
|rowspan="3"|[[XO_1.75_C1|C1]]
|200
|200
|Nanya 128Mx8, NT5CB128M8DN-CF
|Nanya 128Mx8, NT5CB128M8DN-CF
Line 32: Line 33:
|grid T5
|grid T5
|- align="center"
|- align="center"
|C1
|201
|201
|Hynix 256Mx8, H5TQ2G83BFR-H9C
|Hynix 256Mx8, H5TQ2G83BFR-H9C
Line 39: Line 39:
|crunchy
|crunchy
|- align="center"
|- align="center"
|C1
|202
|202
|Nanya 256Mx8, NT5CB256M8BN-CG
|Nanya 256Mx8, NT5CB256M8BN-CG
Line 46: Line 45:
|grid T4 portuguese
|grid T4 portuguese
|- align="center"
|- align="center"
|[[XO_1.75_C2|ramp]]
|rowspan="2"|[[XO_1.75_C2|Ramp]]
|203
|203
|Hynix, 128Mx8, H5TQ1G83TFR-H9C
|Hynix, 128Mx8, H5TQ1G83TFR-H9C
Line 53: Line 52:
|grid T6
|grid T6
|- align="center"
|- align="center"
|[[XO_1.75_C2|ramp]]
|204
|204
|Hynix, 256Mx8, H5TQ2G83BFR-H9C
|Hynix, 256Mx8, H5TQ2G83BFR-H9C
Line 59: Line 57:
|Y
|Y
|crunchy
|crunchy
|- align="center"
|rowspan="10"|Testing
|200X1
|Nanya, 256Mx8, NT5CB256M8BN-CG
|Toshiba 4GB 24nm, THGBM4G5D1HBAIR
|Y
|various
|- align="center"
|200X2
|Hynix, 128Mx8, H5TQ2G83TFR-H9C
|Toshiba 4GB 24 nm, THGBM4G6D2HBAIR
|Y
|various
|- align="center"
|200X3
|Nanya, 256Mx8, NT5CB256M8BN-CG
|Sandisk 8GB 24 nm, SDIN5C2-8G-L
|Y
|various
|- align="center"
|200X4
|Nanya, 256Mx8, NT5CB256M8BN-CG
|Sandisk 4GB 24 nm, SDIN5D2-4G
|Y
|various
|- align="center"
|200X5
|Hynix, 256Mx8, H5TQ2G83CFR-H9C
|Toshiba 4GB 24 nm, THGBM5G5A1JBAIR
|Y
|various
|- align="center"
|200X6
|Nanya, 256Mx8, NT5CB256M8GN-CG
|Toshiba 8GB 24nm, THGBM4G6D2HBAIR
|Y
|various
|- align="center"
|200X7
|Hynix, 256Mx8, H5TQ2G83CFR-H9C
|Sandisk 4GB 24 nm, SDIN5D2-4G
|Y
|various
|- align="center"
|200X8
|Hynix, 256Mx8, H5TQ2G83CFR-H9C
|Sandisk 4GB 24 nm, SDIN7DP2-8G
|Y
|various
|- align="center"
|200X9
|Hynix, 256Mx8, H5TQ2G83CFR-H9C
|Micron 21A18 JW866
|Y
|various
|- align="center"
|200XA
|Hynix, 256Mx8, H5TQ2G83CFR-H9C
|Micron 2LA18 JW866
|Y
|various
|}
|}

LP Sus -- indicates that a SKU is capable of reaching the expected power levels in suspend, using the "hardware" suspend method.

Testing builds are small runs made during production to test new components.


[[Category:Hardware]]
[[Category:Hardware]]

Latest revision as of 18:52, 26 March 2013

  This page is monitored by the OLPC team.

In the pre-production SKUs, vendors are explicitly specified, allowing us to more easily identify problems specific to a particular component. In production, a particular SKU may contain various qualified parts for a specific component. This chart details the components used in XO-1.75 preproduction laptops:

XO-1.75 Qualification SKUs
Build SKU DDR3 DRAM eMMC Flash ROM LP
Sus 		Keyboard
B1 198 Hynix 128Mx8, H5TQ1G83TFR-H9C Toshiba 4GB 32nm, THGBM3G5D1FBAIE chewy
199 Samsung 128Mx8, K4B1G0846G-BCH9 Sandisk 4GB 32nm, SDIN5C2-4G crunchy
C1 200 Nanya 128Mx8, NT5CB128M8DN-CF Toshiba 8GB 24nm, THGBM4G6D2HBAIR grid T5
201 Hynix 256Mx8, H5TQ2G83BFR-H9C Toshiba 8GB 24nm, THGBM4G6D2HBAIR crunchy
202 Nanya 256Mx8, NT5CB256M8BN-CG Sandisk 8GB 32nm, SDIN5C2-8G grid T4 portuguese
Ramp 203 Hynix, 128Mx8, H5TQ1G83TFR-H9C SanDisk 4GB 32nm, SDIN5C2-4G grid T6
204 Hynix, 256Mx8, H5TQ2G83BFR-H9C Toshiba 8GB 24nm, THGBM4G6D2HBAIR Y crunchy
Testing 200X1 Nanya, 256Mx8, NT5CB256M8BN-CG Toshiba 4GB 24nm, THGBM4G5D1HBAIR Y various
200X2 Hynix, 128Mx8, H5TQ2G83TFR-H9C Toshiba 4GB 24 nm, THGBM4G6D2HBAIR Y various
200X3 Nanya, 256Mx8, NT5CB256M8BN-CG Sandisk 8GB 24 nm, SDIN5C2-8G-L Y various
200X4 Nanya, 256Mx8, NT5CB256M8BN-CG Sandisk 4GB 24 nm, SDIN5D2-4G Y various
200X5 Hynix, 256Mx8, H5TQ2G83CFR-H9C Toshiba 4GB 24 nm, THGBM5G5A1JBAIR Y various
200X6 Nanya, 256Mx8, NT5CB256M8GN-CG Toshiba 8GB 24nm, THGBM4G6D2HBAIR Y various
200X7 Hynix, 256Mx8, H5TQ2G83CFR-H9C Sandisk 4GB 24 nm, SDIN5D2-4G Y various
200X8 Hynix, 256Mx8, H5TQ2G83CFR-H9C Sandisk 4GB 24 nm, SDIN7DP2-8G Y various
200X9 Hynix, 256Mx8, H5TQ2G83CFR-H9C Micron 21A18 JW866 Y various
200XA Hynix, 256Mx8, H5TQ2G83CFR-H9C Micron 2LA18 JW866 Y various

LP Sus -- indicates that a SKU is capable of reaching the expected power levels in suspend, using the "hardware" suspend method.

Testing builds are small runs made during production to test new components.

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