XO 1.75 Parts: Difference between revisions
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|grid T4 portuguese |
|grid T4 portuguese |
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|rowspan="2"|[[XO_1.75_C2| |
|rowspan="2"|[[XO_1.75_C2|Ramp]] |
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|203 |
|203 |
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|Hynix, 128Mx8, H5TQ1G83TFR-H9C |
|Hynix, 128Mx8, H5TQ1G83TFR-H9C |
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|crunchy |
|crunchy |
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|- align="center" |
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|rowspan=" |
|rowspan="10"|Testing |
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|200X1 |
|200X1 |
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|Nanya, 256Mx8, NT5CB256M8BN-CG |
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| ⚫ | |||
|Toshiba 4GB 24nm, |
|Toshiba 4GB 24nm, THGBM4G5D1HBAIR |
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|Y |
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|various |
|various |
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|- align="center" |
|- align="center" |
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|rowspan="3"|testing |
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|200X2 |
|200X2 |
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|Hynix, 128Mx8, |
|Hynix, 128Mx8, H5TQ2G83TFR-H9C |
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|Toshiba 4GB 24 nm, |
|Toshiba 4GB 24 nm, THGBM4G6D2HBAIR |
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| |
|Y |
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|various |
|various |
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|- align="center" |
|- align="center" |
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|rowspan="3"|testing |
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|200X3 |
|200X3 |
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|Nanya, 256Mx8, NT5CB256M8BN-CG |
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| ⚫ | |||
|Sandisk 8GB 24 nm, SDIN5C2-8G-L |
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| ⚫ | |||
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|Y |
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|various |
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|- align="center" |
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|200X4 |
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|Nanya, 256Mx8, NT5CB256M8BN-CG |
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|Sandisk 4GB 24 nm, SDIN5D2-4G |
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| ⚫ | |||
|various |
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|- align="center" |
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|200X5 |
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| ⚫ | |||
|Toshiba 4GB 24 nm, THGBM5G5A1JBAIR |
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| ⚫ | |||
|various |
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|- align="center" |
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|200X6 |
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|Nanya, 256Mx8, NT5CB256M8GN-CG |
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|Toshiba 8GB 24nm, THGBM4G6D2HBAIR |
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|Y |
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|various |
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|- align="center" |
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|200X7 |
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|Hynix, 256Mx8, H5TQ2G83CFR-H9C |
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|Sandisk 4GB 24 nm, SDIN5D2-4G |
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|Y |
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|various |
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|- align="center" |
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|200X8 |
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|Hynix, 256Mx8, H5TQ2G83CFR-H9C |
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|Sandisk 4GB 24 nm, SDIN7DP2-8G |
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|Y |
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|various |
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|- align="center" |
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|200X9 |
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|Hynix, 256Mx8, H5TQ2G83CFR-H9C |
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|Micron 21A18 JW866 |
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|Y |
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|various |
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|- align="center" |
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|200XA |
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|Hynix, 256Mx8, H5TQ2G83CFR-H9C |
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|Micron 2LA18 JW866 |
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|Y |
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|various |
|various |
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|} |
|} |
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LP Sus -- indicates that a SKU is capable of reaching the expected power levels in suspend, using the "hardware" suspend method. |
LP Sus -- indicates that a SKU is capable of reaching the expected power levels in suspend, using the "hardware" suspend method. |
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Testing builds are small runs made during production to test new components. |
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[[Category:Hardware]] |
[[Category:Hardware]] |
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Latest revision as of 18:52, 26 March 2013
This page is monitored by the OLPC team.
In the pre-production SKUs, vendors are explicitly specified, allowing us to more easily identify problems specific to a particular component. In production, a particular SKU may contain various qualified parts for a specific component. This chart details the components used in XO-1.75 preproduction laptops:
| Build | SKU | DDR3 DRAM | eMMC Flash ROM | LP Sus |
Keyboard |
| B1 | 198 | Hynix 128Mx8, H5TQ1G83TFR-H9C | Toshiba 4GB 32nm, THGBM3G5D1FBAIE | chewy | |
| 199 | Samsung 128Mx8, K4B1G0846G-BCH9 | Sandisk 4GB 32nm, SDIN5C2-4G | crunchy | ||
| C1 | 200 | Nanya 128Mx8, NT5CB128M8DN-CF | Toshiba 8GB 24nm, THGBM4G6D2HBAIR | grid T5 | |
| 201 | Hynix 256Mx8, H5TQ2G83BFR-H9C | Toshiba 8GB 24nm, THGBM4G6D2HBAIR | crunchy | ||
| 202 | Nanya 256Mx8, NT5CB256M8BN-CG | Sandisk 8GB 32nm, SDIN5C2-8G | grid T4 portuguese | ||
| Ramp | 203 | Hynix, 128Mx8, H5TQ1G83TFR-H9C | SanDisk 4GB 32nm, SDIN5C2-4G | grid T6 | |
| 204 | Hynix, 256Mx8, H5TQ2G83BFR-H9C | Toshiba 8GB 24nm, THGBM4G6D2HBAIR | Y | crunchy | |
| Testing | 200X1 | Nanya, 256Mx8, NT5CB256M8BN-CG | Toshiba 4GB 24nm, THGBM4G5D1HBAIR | Y | various |
| 200X2 | Hynix, 128Mx8, H5TQ2G83TFR-H9C | Toshiba 4GB 24 nm, THGBM4G6D2HBAIR | Y | various | |
| 200X3 | Nanya, 256Mx8, NT5CB256M8BN-CG | Sandisk 8GB 24 nm, SDIN5C2-8G-L | Y | various | |
| 200X4 | Nanya, 256Mx8, NT5CB256M8BN-CG | Sandisk 4GB 24 nm, SDIN5D2-4G | Y | various | |
| 200X5 | Hynix, 256Mx8, H5TQ2G83CFR-H9C | Toshiba 4GB 24 nm, THGBM5G5A1JBAIR | Y | various | |
| 200X6 | Nanya, 256Mx8, NT5CB256M8GN-CG | Toshiba 8GB 24nm, THGBM4G6D2HBAIR | Y | various | |
| 200X7 | Hynix, 256Mx8, H5TQ2G83CFR-H9C | Sandisk 4GB 24 nm, SDIN5D2-4G | Y | various | |
| 200X8 | Hynix, 256Mx8, H5TQ2G83CFR-H9C | Sandisk 4GB 24 nm, SDIN7DP2-8G | Y | various | |
| 200X9 | Hynix, 256Mx8, H5TQ2G83CFR-H9C | Micron 21A18 JW866 | Y | various | |
| 200XA | Hynix, 256Mx8, H5TQ2G83CFR-H9C | Micron 2LA18 JW866 | Y | various |
LP Sus -- indicates that a SKU is capable of reaching the expected power levels in suspend, using the "hardware" suspend method.
Testing builds are small runs made during production to test new components.