XO 4 Parts: Difference between revisions

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|rowspan="1"|[[XO_4_A2|A2]]
|rowspan="1"|[[XO_4_A2|A2]]
|none
|none
|Hynix 256Mx16
|Hynix 256Mx16, H5TC4G63MFR-PBA
|Sandisk 8GB 24nm
|Sandisk 4GB 24nm, SDIN5D2-4G-L
|OV
|OV
|var
|var

Revision as of 18:28, 5 September 2012

  This page is monitored by the OLPC team.

In the pre-production SKUs, vendors are explicitly specified, allowing us to more easily identify problems specific to a particular component. In production, a particular SKU may contain various qualified parts for a specific component. This chart details the components used in XO-4 preproduction laptops:

XO-4 Qualification SKUs
Build SKU DDR3 DRAM eMMC Flash ROM Cam TP Keyboard
A2 none Hynix 256Mx16, H5TC4G63MFR-PBA Sandisk 4GB 24nm, SDIN5D2-4G-L OV var various
B1 291 Hynix 128Mx16, H5TC2G63DFR-PBA SanDisk 4GB 24nm, SDIN5D2-4G-L SETi Synaptics grid Spanish
292 Nanya 128Mx16, NT5CC128M16HP-DI SanDisk 8GB 24nm, SDIN5C2-8G-L OV AVC crunchy US/Intl
293 Hynix 256Mx16, H5TC4G63MFR-PBA Toshiba 8GB 24nm, THGBM4G6D2HBAIR OV AVC crunchy US/Intl

Testing builds are small runs made during production to test new components.