XO 4 Parts

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In the pre-production SKUs, vendors are explicitly specified, allowing us to more easily identify problems specific to a particular component. In production, a particular SKU may contain various qualified parts for a specific component. This chart details the components used in XO-4 preproduction laptops:

XO-4 Qualification SKUs

Build	SKU	CPU	DDR3 DRAM	eMMC Flash ROM	Cam	TP	Keyboard
A2	none	1 GHz	Hynix 256Mx16, H5TC4G63MFR-PBA	Sandisk 4GB 24nm, SDIN5D2-4G-L	OV	var	various
B1	291	1 GHz	Hynix 128Mx16, H5TC2G63DFR-PBA	SanDisk 4GB 24nm, SDIN5D2-4G-L	OV	Synaptics	grid English
	292	1 GHz	Nanya 128Mx16, NT5CC128M16HP-DI	SanDisk 8GB 24nm, SDIN5C2-8G-L	OV	AVC	crunchy US/Intl
	293	1 GHz	Hynix 256Mx16, H5TC4G63MFR-PBA	Toshiba 8GB 24nm, THGBM4G6D2HBAIR	OV	AVC	crunchy US/Intl
	294	1 GHz	Hynix 128Mx16, H5TC2G63DFR-PBA	SanDisk 4GB 24nm, SDIN5D2-4G-L	OV	Synaptics	grid Spanish
C1	295	1 GHz	Micron 256Mx16, MT41K256M16HA-125:E	Toshiba 8GB 19nm, THGBM5G6A1JBAI	OV	AVC	grid US/Intl
	296	1.2 GHz	Nanya 256Mx16, NT5CC256M16BP-D	Toshiba 8GB 24nm, THGBM4G6D2HBAIR	SETi	Synaptic	crunchy US/Intl
	297	1.2 GHz	Hynix 128Mx16, H5TC2G63DFR-PBA	Toshiba 4GB 19nm, THGBM5G5A1JBAIR	OV	AVC	grid US/Intl
	298	1 GHz	Micron 128Mx16, MT41K128M16JT-125:K	Micron 4GB 24nm, MTFC4GMXEA-WT	SETi	Synaptic	crunchy US/Intl

Testing builds are small runs made during production to test new components.